The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Dec. 17, 2021
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Donald Farrell, Raleigh, NC (US);

Marvin Marbell, Cary, NC (US);

Jeremy Fisher, Raleigh, NC (US);

Dan Namishia, Wake Forest, NC (US);

Scott Sheppard, Chapel Hill, NC (US);

Dan Etter, Durham, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H10D 30/47 (2025.01); H10D 30/65 (2025.01); H10D 62/832 (2025.01); H10D 62/85 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01L 23/49575 (2013.01); H01L 23/645 (2013.01); H01L 23/647 (2013.01); H01L 24/85 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01); H10D 30/47 (2025.01); H10D 30/65 (2025.01); H10D 62/8325 (2025.01); H10D 62/8503 (2025.01); H10D 84/83 (2025.01);
Abstract

A transistor device includes a metal submount; a transistor die arranged on said metal submount; at least one integrated passive device (IPD) component that includes a substrate arranged on said metal submount; and one or more interconnects extending between the transistor die and the at least one integrated passive device (IPD) component. The substrate includes a silicon carbide (SiC) substrate.


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