The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Oct. 18, 2022
Disco Corporation, Tokyo, JP;
Takashi Mori, Tokyo, JP;
Yoshinori Kakinuma, Tokyo, JP;
Jonghyun Ryu, Tokyo, JP;
Mitsuru Ikushima, Tokyo, JP;
Makoto Saito, Tokyo, JP;
Yohei Masuda, Tokyo, JP;
Takashi Uchiho, Tokyo, JP;
Yoshinobu Saito, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.