The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Jul. 28, 2022
Applicant:

Brigham Young University, Provo, UT (US);

Inventors:

Henry Davis, Provo, UT (US);

Brian Jensen, Orem, UT (US);

Nathan B. Crane, Vinyard, UT (US);

Robert C. Davis, Provo, UT (US);

James Harkness, Mapleton, UT (US);

Isa Kohls, Provo, UT (US);

Richard Vanfleet, Provo, UT (US);

Assignee:

BRIGHAM YOUNG UNIVERSITY, Provo, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); B22F 3/10 (2006.01); B22F 5/10 (2006.01); B22F 10/28 (2021.01); B22F 10/62 (2021.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B81B 1/00 (2006.01); B81C 1/00 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); B22F 3/10 (2013.01); B22F 5/10 (2013.01); B22F 10/28 (2021.01); B22F 10/62 (2021.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B81B 1/00 (2013.01); B81C 1/00071 (2013.01); B22F 2301/10 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B81C 2201/0128 (2013.01); F28D 2015/0225 (2013.01);
Abstract

Embodiments disclosed are systems and methods for interfacing a metallic capillary in a microchannel of a metallic body. A method may include inserting a portion of the metallic capillary into a portion the microchannel of the metallic body, sintering the portion of the metallic capillary to the portion of the microchannel of the metallic body, disposing a sacrificial powder at least proximate to the metallic capillary and the metallic body after sintering the portion of the metallic capillary and the portion of the microchannel of the metallic body, and infiltrating at least the portion of the metallic capillary sintered to the portion of the microchannel of the metallic body with an infiltrant in the presence of the sacrificial powder disposed at least proximate to the metallic capillary and the metallic body.


Find Patent Forward Citations

Loading…