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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12415931 B1

PDFFull Text
Date of Patent:
Sep. 16, 2025

Filed:

Mar. 24, 2021

Conductive polymer composition, substrate, and method for producing substrate

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takayuki Nagasawa, Joetsu, JP;

Jun Hatakeyama, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Mark Kopec

Assistant Examiner:

Jaison P Thomas

Int. Cl.
CPC ...
C09D 5/24 (2006.01); C08F 212/14 (2006.01); C08F 220/38 (2006.01); C08K 5/17 (2006.01); C09D 7/20 (2018.01); C09D 7/45 (2018.01); C09D 7/63 (2018.01); C09D 11/033 (2014.01); C09D 11/107 (2014.01); C09D 11/38 (2014.01); C09D 11/52 (2014.01); C09D 125/18 (2006.01); C09D 133/16 (2006.01); H10K 71/13 (2023.01); H10K 85/10 (2023.01); H10K 50/17 (2023.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08F 212/24 (2020.02); C08F 212/30 (2020.02); C08F 220/382 (2020.02); C08K 5/175 (2013.01); C09D 7/20 (2018.01); C09D 7/45 (2018.01); C09D 7/63 (2018.01); C09D 11/033 (2013.01); C09D 11/107 (2013.01); C09D 11/38 (2013.01); C09D 11/52 (2013.01); C09D 125/18 (2013.01); C09D 133/16 (2013.01); H10K 71/135 (2023.02); H10K 85/113 (2023.02); H10K 85/141 (2023.02); H10K 85/151 (2023.02); H10K 50/17 (2023.02);
Abstract

A conductive polymer composition containing: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by the following general formula (2); HO (D) for dispersing the composite; and a water-soluble organic solvent (C). This provides a composition which has favorable filterability and film formability, and which is capable of relieving acidity and forming a conductive film with high transparency. Moreover, since the HO dispersion of the conductive polymer compound is mixed with an organic solvent, the surface tension and the contact angle are so low that leveling property on a substrate is imparted. The composition is usable in droplet-coating methods. Since an organic solvent having a higher boiling point than HO is used as the organic solvent, the composition can avoid solid content precipitation around a nozzle and solid content precipitation due to drying between ejecting the liquid material from a nozzle tip and landing on a substrate.

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