The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Nov. 05, 2020
Intel Corporation, Santa Clara, CA (US);
Gaurav Patankar, Chandler, AZ (US);
Ruander Cardenas, Portland, OR (US);
Mark Macdonald, Beaverton, OR (US);
Akhilesh P. Rallabandi, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Heterogeneous heat pipe solutions provide both low thermal resistance and a high Q. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.