Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof

Abstract

An electronic package and a manufacturing method thereof are provided, where the manufacturing method is to dispose an electronic structure with a plurality of conductive bumps and a thermal conductor on its upper surface on a carrier structure via external bumps on its lower surface, so that when reflowing the external bumps, the heat of the heat source joint is conducted from the upper surface of the electronic structure to the external bumps on the lower surface via the thermal conductor, so as to facilitate the heating and reflowing of the external bumps to avoid the problem of non-wetting of the solder.