The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Jan. 16, 2024
Disco Corporation, Tokyo, JP;
Atsushi Komatsu, Tokyo, JP;
Koichi Makino, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A cutting method that measures heights of an outer periphery of a wafer, calculates height distribution data, and then calculates change rates of the heights of the outer periphery of the wafer. Based on results of a comparison between the height change rates and a threshold, the cutting method determines whether or not foreign matter exists on a back surface of the wafer (i.e., whether or not foreign matter exists on a holding surface of a chuck table). The existence of foreign matter on the holding surface can hence be detected appropriately. If foreign matter exists on the holding surface, a worker is notified, and the cutting operation is cancelled. Therefore, the cutting method can appropriately give notification to the worker that foreign matter is stuck on the holding surface, and can also appropriately avoid performing cutting processing with foreign matter stuck on the holding surface.