The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jun. 17, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kazushi Shoji, Sapporo, JP;

Shintaro Saruwatari, Sapporo, JP;

Nobutoshi Terasawa, Sapporo, JP;

Motokatsu Miyazaki, Sapporo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G05B 23/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 23/0275 (2013.01); H01L 21/67248 (2013.01); H01L 21/67276 (2013.01); G05B 2219/32368 (2013.01); G05B 2219/45031 (2013.01);
Abstract

An information processing apparatus detects an abnormality sign in a semiconductor manufacturing apparatus. The apparatus includes: a sensor data collector configured to acquire sensor waveform data represented with respect to a sensor value axis and a time axis measured by a semiconductor manufacturing apparatus that is executing a process according to a same recipe; a monitoring band calculator configured to calculate each monitoring band represented with respect to the sensor value axis and the time axis used in a waveform monitoring method from a predetermined number or more of the sensor waveform data; and an abnormality sign detector configured to monitor a waveform of the sensor waveform data using each monitoring band represented with respect to the sensor value axis and the time axis and detect an abnormality sign of the semiconductor manufacturing apparatus.


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