The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Aug. 16, 2023
Applicant:

Advantest Test Solutions, Inc.;

Inventors:

Gregory Cruzan, San Jose, CA (US);

Karthik Ranganathan, San Jose, CA (US);

Gilberto Oseguera, San Jose, CA (US);

Joe Koeth, San Jose, CA (US);

Paul Ferrari, San Jose, CA (US);

James Hastings, San Jose, CA (US);

Chee Wah Ho, San Jose, CA (US);

Assignee:

Advantest Test Solutions, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2863 (2013.01); G01R 1/0466 (2013.01); G01R 31/2877 (2013.01); G01R 31/2889 (2013.01);
Abstract

Embodiments of the present invention provide a gimbaling socket structure that uses tension to bring a device under test (DUT) disposed in the socket into secure contact with a liquid cooled thermal array or the like to cool the DUT during testing. The gimbaling socket structure is secured to a tension spring and can move freely in 3 dimensions to bring the surfaces of the DUT and the thermal array (or components thereof, such as TEC/ATI layers) into even, level, and secure contact with each other, thereby preventing air gaps between surfaces and improving thermal performance. The even, secure contact between surfaces improves thermal cooling and reduces variation in cooling efficiency. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices.


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