The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Feb. 27, 2020
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Masashi Momma, Tokyo, JP;

Shiro Oguchi, Tokyo, JP;

Ryota Takei, Yashio, JP;

Kenji Yumoto, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/5831 (2006.01); B23B 27/14 (2006.01);
U.S. Cl.
CPC ...
C04B 35/5831 (2013.01); B23B 27/148 (2013.01); B23B 2226/125 (2013.01); C04B 2235/3843 (2013.01); C04B 2235/3856 (2013.01); C04B 2235/386 (2013.01); C04B 2235/3886 (2013.01); C04B 2235/404 (2013.01);
Abstract

A cBN-based ultra-high pressure sintered body contains cBN particles and a binder phase. The binder phase contains at least one of a nitride or oxide of Al or a nitride, carbide, or carbonitride of Ti, and a metal boride having an average particle diameter of 20 to 300 nm is dispersed in an amount of 0.1 to 5.0 vol % in the binder phase. The metal boride includes a metal boride (B) containing at least one of Nb, Ta, Cr, Mo, and W as a metal component and containing no Ti and a metal boride (A) containing only Ti as a metal component. In a case where a ratio (vol %) of the metal boride (A) in the metal boride is represented by Vand a ratio (vol %) of the metal boride (B) is represented by V, a ratio of V/Vis 0.1 to 1.0.


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