The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

May. 13, 2022
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Daniel Jenner Lichtenwalner, Raleigh, NC (US);

Sei-Hyung Ryu, Cary, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 12/01 (2025.01); H10D 12/00 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 12/032 (2025.01); H10D 12/481 (2025.01); H10D 62/8325 (2025.01);
Abstract

A vertical semiconductor and method for fabricating the same is disclosed. In one embodiment, fabrication entails providing a precursor comprising a substrate and a drift region over the substrate. A plurality of trenches is etched into the drift region from a top surface of the drift region such that a plurality of mesas remains in an upper portion of the drift region. The plurality of trenches is then filled with a first material. A vertical semiconductor device includes a plurality of mesas extends from an upper portion of the drift region, wherein there are no regrowth interfaces between the drift region and the plurality of mesas. A first material fills the trenches between each one of the plurality of mesas. At least one first contact over at least one of the plurality of mesas. At least one second contact over a bottom surface of the substrate.


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