The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Jun. 06, 2018
Applicant:

Ekc Technology, Inc., Hayward, CA (US);

Inventors:

Ajay Virkar, San Mateo, CA (US);

Xiqiang Yang, Hayward, CA (US);

Ying-Syi Li, Fremont, CA (US);

Dennis Mckean, Milpitas, CA (US);

Melburne C. Lemieux, San Jose, CA (US);

Assignee:

EKC Technology, Inc., Hayward, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B32B 15/02 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); C09D 11/52 (2014.01); G06F 3/044 (2006.01); H03K 17/96 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H03K 17/9622 (2013.01); B32B 15/02 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C09D 11/52 (2013.01); G06F 3/044 (2013.01); H05K 1/097 (2013.01); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2457/00 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H03K 2217/96031 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); H05K 3/1283 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/026 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1157 (2013.01); H05K 2203/125 (2013.01); Y10T 428/12424 (2015.01); Y10T 428/12444 (2015.01); Y10T 442/655 (2015.04);
Abstract

Reduction/oxidation reagents have been found to be effective to chemically cure a sparse metal nanowire film into a fused metal nanostructured network through evidently a ripening type process. The resulting fused network can provide desirable low sheet resistances while maintaining good optical transparency. The transparent conductive films can be effectively applied as a single conductive ink or through sequential forming of a metal nanowire film with the subsequent addition of a fusing agent. The fused metal nanowire films can be effectively patterned, and the patterned films can be useful in devices, such as touch sensors.


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