The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Jun. 28, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Wen-Shiang Liao, Miaoli County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01Q 1/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01Q 1/48 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01);
Abstract
A semiconductor structure includes an antenna pad, a ground plane and a plurality of conductive vias. The ground plane is disposed over the antenna pad and includes a plurality of first conductive patterns separated from one another. The conductive vias are disposed between the antenna pad and the ground plane. The plurality of conductive vias are arranged to surround an area of the antenna pad and electrically connected to the antenna pad, and the plurality of first conductive patterns are overlapped with the area of the antenna pad.