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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12407087 B1

PDFFull Text
Date of Patent:
Sep. 02, 2025

Filed:

Jun. 28, 2021

Semiconductor structures and method of forming the same

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Wen-Shiang Liao, Miaoli County, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Sue A Purvis

Assistant Examiner:

Carnell Hunter, Iii

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01Q 1/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01Q 1/48 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A semiconductor structure includes an antenna pad, a ground plane and a plurality of conductive vias. The ground plane is disposed over the antenna pad and includes a plurality of first conductive patterns separated from one another. The conductive vias are disposed between the antenna pad and the ground plane. The plurality of conductive vias are arranged to surround an area of the antenna pad and electrically connected to the antenna pad, and the plurality of first conductive patterns are overlapped with the area of the antenna pad.

Find Patent Forward Citations

Liao, Wen-Shiang. (2025). Semiconductor structures and method of forming the same (U.S. Patent No. 12407087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12407087

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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