The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Aug. 23, 2022
Applicant:
Macronix International Co., Ltd., Hsinchu, TW;
Inventors:
Dai-Ying Lee, Hsinchu County, TW;
Yu-Chao Huang, Hsinchu, TW;
Assignee:
MACRONIX INTERNATIONAL CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01);
Abstract
A semiconductor element and a method for manufacturing the same are provided. The semiconductor element includes a plug and a via on the plug and electrically connected to the plug. The plug includes a tungsten plug and a conductive layer on the tungsten plug. The tungsten plug and the conductive layer include different materials. The tungsten plug has a first width in a lateral direction. The conductive layer has a second width in the lateral direction. The second width is greater than or equal to the first width. The conductive layer is between the via and the tungsten plug.