The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Jul. 12, 2022
Applicant:

Flosfia Inc., Kyoto, JP;

Inventors:

Isao Takahashi, Kyoto, JP;

Kazuyoshi Norimatsu, Kyoto, JP;

Takashi Shinohe, Kyoto, JP;

Assignee:

FLOSFIA, INC., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 23/473 (2006.01); H10D 62/40 (2025.01); H10D 62/80 (2025.01); C30B 25/02 (2006.01); C30B 29/16 (2006.01); H10D 8/60 (2025.01); H10D 12/00 (2025.01); H10D 30/66 (2025.01);
U.S. Cl.
CPC ...
H10D 62/405 (2025.01); H01L 23/473 (2013.01); H10D 62/80 (2025.01); C30B 25/02 (2013.01); C30B 29/16 (2013.01); H10D 8/60 (2025.01); H10D 12/441 (2025.01); H10D 30/668 (2025.01);
Abstract

Provided is a semiconductor device including: at least a semiconductor layer having a corundum structure, the semiconductor layer including a first surface having at least a first side and a second side shorter than the first side, the first surface being a c-plane or an m-plane, a direction of the first side being a direction of a c-axis or a direction of an m-axis.


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