The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Jan. 04, 2023
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Chung-Hsien Liu, Taichung, TW;
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/68 (2025.01); H01L 21/762 (2006.01); H10D 30/01 (2025.01);
U.S. Cl.
CPC ...
H10D 30/68 (2025.01); H01L 21/76224 (2013.01); H10D 30/0411 (2025.01);
Abstract
A semiconductor structure is provided. The semiconductor structure includes a substrate with a trench between active regions, a tunneling dielectric layer disposed on the substrate, a floating gate layer disposed on the tunneling dielectric layer, and an isolation feature disposed in the trench and on the substrate. The isolation feature has a first opening and a second opening below the first opening. The semiconductor structure further includes a mask disposed on the sidewall of the first opening, and a dielectric stack layer disposed directly above the mask and the second opening.