The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Jan. 12, 2023
Changxin Memory Technologies, Inc., Hefei, CN;
Qinghua Han, Hefei, CN;
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Abstract
Embodiments of the present disclosure relate to a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a substrate; etching the substrate to form a plurality of body structures arranged at intervals in a first direction, wherein a space between adjacent ones of the body structures is filled with a first isolation layer, each of the body structures includes a body layer and a plurality of body pillars that are discrete and are located on the body layer, the plurality of body pillars are arranged at intervals along a second direction, and the first direction is different from the second direction; etching a part of the body layer between adjacent ones of the body pillars, to form a plurality of openings in the body layer; and siliconizing the body layer through the plurality of openings.