The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

May. 12, 2021
Applicant:

Sumitomo Electric Device Innovations, Inc., Yokohama, JP;

Inventor:

Ikuo Nakashima, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/057 (2006.01); H01L 23/12 (2006.01); H01L 23/66 (2006.01); H01P 5/02 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 23/00 (2013.01); H01L 23/66 (2013.01); H01L 2223/6627 (2013.01);
Abstract

A semiconductor device includes a base, a matching circuit including a substrate, a ground layer, and a signal line, wherein a width of the signal line on a first end side of the substrate is smaller than a width of the substrate and larger than that of the signal line on a second end side, and a distance between the ground layer and the signal line on the first end side is larger than a distance therebetween on the second end side, a semiconductor element electrically connected to the signal line on the first end side of the matching circuit by first bonding wires, a frame body, a feedthrough having a lead, and second bonding wires electrically connected to the lead and the signal line on the second end side, wherein the first bonding wires are arranged in parallel, and the second bonding wires are arranged in parallel.


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