The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Dec. 06, 2023
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Brice Mcpherson, Fayetteville, AR (US);

Daniel Martin, Fayetteville, AR (US);

Jennifer Stabach, Fayetteville, AR (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 24/49 (2013.01); H01L 25/072 (2013.01); H01L 22/14 (2013.01); H01L 22/30 (2013.01); H01L 22/32 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/04042 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/30101 (2013.01);
Abstract

A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.


Find Patent Forward Citations

Loading…