The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Jan. 20, 2022
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Shuzo Mitani, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23K 26/50 (2014.01); H10D 89/00 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B23K 26/50 (2015.10); H10D 89/011 (2025.01); H01L 2221/68327 (2013.01);
Abstract
A manufacturing method of chips includes forming modified layers that become points of origin of dividing along planned dividing lines, grinding the back surface of the wafer by grinding abrasive stones to thin the wafer into a finished thickness, and dividing the wafer into the chips along the planned dividing lines using the modified layers as the points of origin. The manufacturing method also includes sticking an expanding tape having elasticity to the back surface of the wafer for which grinding processing has been executed, expanding the expanding tape and widening the interval between the respective chips along the planned dividing lines.