IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12400882 B1

PDFFull Text
Date of Patent:
Aug. 26, 2025

Filed:

Aug. 01, 2022

Substrate processing apparatus and substrate processing method

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hiroki Sakurai, Kumamoto, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Tanya E. Harkins

Primary Examiner:

Roberts P Culbert

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B05B 1/02 (2006.01); B05B 1/14 (2006.01); B05B 7/24 (2006.01); B05B 7/26 (2006.01); B05B 12/00 (2018.01); B05B 12/04 (2006.01); B05B 12/14 (2006.01); G05D 11/02 (2006.01); H01L 21/673 (2006.01); B08B 3/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); B05B 1/02 (2013.01); B05B 1/14 (2013.01); B05B 7/24 (2013.01); B05B 7/26 (2013.01); B05B 12/004 (2013.01); B05B 12/04 (2013.01); B05B 12/1418 (2013.01); G05D 11/02 (2013.01); H01L 21/67017 (2013.01); H01L 21/67023 (2013.01); H01L 21/67051 (2013.01); H01L 21/6715 (2013.01); H01L 21/67346 (2013.01); B08B 3/02 (2013.01); H01L 21/31111 (2013.01);
Abstract

A substrate processing apparatus includes: a substrate holder configured to hold a substrate; a processing liquid supply part configured to supply a processing liquid to the substrate held by the substrate holder; a chemical liquid supply part configured to supply a chemical liquid as a component of the processing liquid to the processing liquid supply part; a pure water supply part configured to supply pure water as a component of the processing liquid to the processing liquid supply part; a low-dielectric constant solvent supply part configured to supply a low-dielectric constant solvent as a component of the processing liquid to the processing liquid supply part; and a controller configured to control a ratio of the chemical liquid, the pure water, and the low-dielectric constant solvent contained in the processing liquid by controlling the chemical liquid supply part, the pure water supply part, the low-dielectric constant solvent supply part.

Find Patent Forward Citations

Loading…