The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Dec. 22, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yu-Der Chih, Hsinchu, TW;

May-Be Chen, Hsinchu, TW;

Ya-Chin King, Taipei, TW;

Chrong Jung Lin, Hsinchu, TW;

Burn Jeng Lin, Hsinchu, TW;

Bo Yu Lin, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/027 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70308 (2013.01); H01L 21/0274 (2013.01); H01L 22/20 (2013.01);
Abstract

A semiconductor fabrication apparatus and a method of using the same are disclosed. In one aspect, the apparatus includes a holder configured to place a substrate and a radiation source configured to provide radiation to transfer a pattern onto the substrate. The apparatus also includes a plurality of sensing devices configured to provide a reference signal based on an intensity of the radiation when the substrate is not present. The apparatus further includes a controller, operatively coupled to the plurality of sensing devices, configured to adjust the intensity of the radiation based on the reference signal.


Find Patent Forward Citations

Loading…