The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Nov. 07, 2019
Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Takahiro Kuroda, Tokyo, JP;

Tomohiro Nagoya, Tokyo, JP;

Naoki Tomori, Tokyo, JP;

Assignee:

RESONAC CORPORATION, TOKYO, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 7/25 (2018.01); C09J 133/10 (2006.01); C09J 133/14 (2006.01); C09J 133/20 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); C09J 7/25 (2018.01); C09J 133/10 (2013.01); C09J 133/14 (2013.01); C09J 133/20 (2013.01); H01L 21/568 (2013.01); H01L 21/6836 (2013.01); C09J 2433/00 (2013.01);
Abstract

A temporary protective film for temporarily protecting a surface of a semiconductor substrate that is opposite to a surface on which a semiconductor element is mounted. The temporary protective film includes an adhesive layer containing acrylic rubber. When the temporary protective film is attached to a copper alloy plate at 25° C. so that the adhesive layer is in contact with the copper alloy plate, and the obtained laminate is sequentially heated at 180° C. for 60 minutes and at 200° C. for 60 minutes, a 90-degree peeling strength of the temporary protective film against the copper alloy plate is 5 N/m or more at 25° C. before heating the laminate and 150 N/m or less at 50° C. after heating the laminate.


Find Patent Forward Citations

Loading…