The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Aug. 22, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Feng-Chien Hsieh, Pingtung County, TW;

Yun-Wei Cheng, Taipei, TW;

Ping Kuan Chang, Hsinchu, TW;

Kuo-Cheng Lee, Tainan, TW;

Cheng-Ming Wu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H01L 25/04 (2023.01); H10F 39/18 (2025.01); H10F 71/00 (2025.01); H10F 77/00 (2025.01); H10F 77/30 (2025.01); H10F 77/42 (2025.01); H10F 77/90 (2025.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H01L 25/043 (2013.01); H10F 39/018 (2025.01); H10F 39/024 (2025.01); H10F 39/809 (2025.01); H10F 77/315 (2025.01); H10F 77/42 (2025.01); H10F 77/935 (2025.01); H10F 39/182 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01); H10F 39/8067 (2025.01); H10F 71/00 (2025.01); H10F 77/90 (2025.01);
Abstract

The present disclosure provides an integrated circuit (IC) structure with a solar cell and an image sensor array. An integrated structure according to the present disclosure includes a first substrate including a plurality of photodiodes, an interconnect structure disposed on the first substrate, a first bonding layer disposed on the interconnect structure, a second bonding layer disposed on the first bonding layer, a second substrate disposed on the second bonding layer, and a transparent conductive oxide layer disposed on the second substrate.


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