The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Apr. 08, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Hsiu-Ying Cho, Hsin Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01P 3/08 (2013.01); H01L 2223/6627 (2013.01);
Abstract

Transmission line structures are provided. The first and second conductive lines are formed in a metal layer over the semiconductor substrate and extend in a first direction. The first transmission line includes a first sub-line extending in the first direction, a plurality of second sub-lines extending toward the first conductive line, and a plurality of third sub-lines extending toward the second conductive line. The first dielectric material zones are formed between the second sub-lines and the first conductive line. The second dielectric material zones are formed between the third sub-lines and the second conductive line. The first and second dielectric material zones are separated from the first and second conductive lines and the first transmission line by an insulation material. Dielectric constant of the insulation material is less than that of the first and second dielectric material zones.


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