The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Aug. 08, 2022
Micron Technology, Inc., Boise, ID (US);
Shuangqiang Luo, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods, systems, and devices for support structures for three dimensional memory arrays are described. For example, a portion of a memory die may formed at least in part from a stack of material layers deposited over a substrate, and the memory die may include a set of access lines in a staircase arrangement over the stack. At least a portion of the stack of material layers between the staircase arrangement and the substrate may be configured to be continuous, or uninterrupted, which may result in fewer physical discontinuities in the stack of material layers below the staircase arrangement. In some examples, at least a portion of the stack of material layers (e.g., conductive portions) in such a region may be electrically isolated from other portions of the memory die, which may support aspects of structural support while limiting electrical interaction with the other portions of the memory die.