Semiconductor device and method of processing strip of electrical components using mesh jig

Abstract

A semiconductor device has an interconnect substrate and an electrical component disposed over the substrate. A first carrier including a window is disposed over the interconnect substrate with the electrical component disposed within the window. A second carrier is disposed over the first carrier with a plurality of posts extending through the first carrier. The substrate is disposed over a third carrier. The posts may extend through the first carrier outside a footprint of the substrate. Alternatively, at least one of the posts extend through an opening in the substrate and the remaining posts are outside the footprint of the substrate. A plurality of pins extends from the second carrier to a dummy area of the substrate. Openings can be formed in a surface of the second carrier. The combination of first carrier, second carrier, and third carrier constitutes a mesh jig to support the strip of electrical components.