The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jun. 13, 2019
Hitachi High-tech Corporation, Tokyo, JP;
Masanori Ouchi, Tokyo, JP;
Shinichi Shinoda, Tokyo, JP;
Yasutaka Toyoda, Tokyo, JP;
Ryou Yumiba, Tokyo, JP;
Hiroyuki Shindo, Tokyo, JP;
Hitachi High-Tech Corporation, Tokyo, JP;
Abstract
The purpose of the present invention is to provide a computer program for achieving die-to-database inspection at high speed and with few false reports, and a semiconductor inspection device using the same. To achieve this purpose, the present invention proposes: a computer program comprising an encoder layer that is configured to determine the features of a design data image, and a decoder layer that is configured to generate, on the basis of a variation in an image (inspection target image) obtained by photographing an inspection target pattern, a statistic pertaining to the brightness values of pixels from feature values output by the encoder layer, wherein die-to-database inspection with few false reports can be achieved by comparing the inspection target image and the statistic obtained from the decoder layer and pertaining to the brightness values, and thereby detecting a defect region in the image; and a semiconductor inspection device using the same.