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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12393122 B1

PDFFull Text
Date of Patent:
Aug. 19, 2025

Filed:

Dec. 14, 2021

Thinner composition and method of processing surfaces of semiconductor substrates

Applicants:

SK Hynix Inc., Icheon-si, KR;

Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;

Inventors:

Kyung Hee Oh, Icheon-si, KR;

Jun Kyoung Lee, Icheon-si, KR;

Tomoya Kumagai, Kanagawa, JP;

Motoki Takahashi, Kanagawa, JP;

Assignees:

SK hynix Inc., Icheon-si, KR;

TOKYO OHKA KOGYO CO., LTD., Kanagawa, JP;

Attorneys:

AGORA LAW GROUP, PLLC

KALAI WINELAND

JAMES NAMIKI

MANASI VAKIL

JAMES KIM

GARY LEVIN

HYUNJEONG KIM

Primary Examiner:

Gregory R Delcotto

Int. Cl.
CPC ...
C11D 7/26 (2006.01); C11D 3/20 (2006.01); C11D 7/50 (2006.01); G03F 1/68 (2012.01); G03F 7/00 (2006.01); G03F 7/42 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70033 (2013.01); C11D 3/2068 (2013.01); C11D 3/2096 (2013.01); C11D 7/263 (2013.01); C11D 7/266 (2013.01); C11D 7/267 (2013.01); G03F 1/68 (2013.01); G03F 7/422 (2013.01); C11D 2111/22 (2024.01);
Abstract

The present disclosure relates to a thinner composition for removing a resist and a processing method of a semiconductor substrate using the thinner composition. Particularly, the thinner composition includes (a) propylene glycol monoalkyl ether, (b) propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone. In addition, the processing method of a semiconductor substrate includes applying a resist composition on a semiconductor substrate and removing the applied resist composition using the thinner composition of the present invention.

Find Patent Forward Citations

Oh, Kyung. (2025). Thinner composition and method of processing surfaces of semiconductor substrates (U.S. Patent No. 12393122). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12393122

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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