The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Jun. 09, 2023
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Alexander Komposch, Morgan Hill, CA (US);

Jason R. Fender, Chandler, AZ (US);

Eric Jacob Palsgaard, Morgan Hill, CA (US);

Douglas John Kroon, Morgan Hill, CA (US);

Matthew Kirke Mellor, Hollister, CA (US);

Donald I. Fowlkes, San Jose, CA (US);

Assignee:

WOLFSPEED, INC., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 23/34 (2006.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2896 (2013.01); G01R 31/2884 (2013.01); H01L 23/34 (2013.01); H01R 12/716 (2013.01); H01R 13/2471 (2013.01);
Abstract

In one example, a system includes a semiconductor package having a metal contact. The system includes a metal submount. The metal submount includes a plurality of spring pin connectors embedded in the metal submount, the plurality of spring pin connectors being thermally and electrically connected to one another through the metal submount. The metal contact of the semiconductor package is thermally and electrically coupled to the metal submount through the plurality of spring pin connectors.


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