The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Feb. 02, 2023
Applicant:

Grand Process Technology Corp., Hsinchu, TW;

Inventors:

Li-Tso Huang, Hsinchu, TW;

Hsiu-Kai Chang, Hsinchu, TW;

Chin-Yuan Wu, Hsinchu, TW;

Ming-Che Hsu, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 (2006.01); B08B 3/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68764 (2013.01); B08B 3/022 (2013.01); B08B 3/04 (2013.01); H01L 21/67051 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01);
Abstract

A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.


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