The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Oct. 16, 2024
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Takenori Takahashi, Tokyo, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
A wafer chuck having a holding surface for holding a wafer, the wafer chuck includes: a heating and cooling unit configured to heat or cool the wafer chuck; at least one temperature sensor disposed in the wafer chuck; and a heat flow sensor which is disposed in the wafer chuck, and in which a plurality of thermocouples are connected in series and connecting parts between thermocouples adjacent to each other are alternately disposed at a first depth position from the holding surface and at a second depth position deeper than the first depth position. The heat flow sensor has a plurality of temperature measurement points provided for the respective thermocouples, and the plurality of temperature measurement points are disposed over an entirety of the wafer chuck when the wafer chuck is seen in plan view.