The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Dec. 11, 2019
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Yuki Ito, Ageo, JP;
Hiroyuki Mori, Tsukuba, JP;
Hiroyuki Matsukawa, Sakai, JP;
Norihisa Iida, Sakai, JP;
Motohiro Hitaka, Sakai, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C22F 1/08 (2013.01);
Abstract
This pure copper plate includes Cu having a purity of 99.96 mass % or higher, with a remainder of unavoidable impurities, wherein an amount of P is 2 mass ppm or less, and a total amount of Pb, Se, and Te is 10 mass ppm or less. The amount of S may be in a range of 2 mass ppm or more and 20 mass ppm or less.