The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

May. 18, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventor:

Sivakumar Dhandapani, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/18 (2006.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 49/00 (2012.01); B24B 49/16 (2006.01); B24B 53/017 (2012.01); G05B 23/02 (2006.01);
U.S. Cl.
CPC ...
B24B 49/186 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 49/003 (2013.01); B24B 49/16 (2013.01); B24B 53/017 (2013.01); G05B 23/0254 (2013.01);
Abstract

In one embodiment, a method is provided for polishing a substrate. The method generally includes receiving a plurality of dwell times of a pad conditioning disk, wherein the plurality of dwell times are to be used in a pad conditioning process performed on a pad disposed on a platen, and each dwell time corresponding to a zone of a plurality of zones of the pad disposed on the platen, determining a plurality of total pad conditioning disk cut times to be used in the pad conditioning process, each total pad conditioning disk cut time corresponding to a zone of the plurality of zones, and generating a first pad wear removal model based on a set of parameters, including the plurality of dwell times and the plurality of total pad conditioning disk cut times.


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