The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

May. 04, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yi-Ching Huang, Taipei, TW;

Tsung-Yu Chiang, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/66 (2025.01); H10D 30/01 (2025.01); H10D 30/60 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H10D 64/518 (2025.01); H10D 30/0223 (2025.01); H10D 30/60 (2025.01); H10D 64/017 (2025.01); H10D 64/021 (2025.01); H10D 64/667 (2025.01); H10D 84/0142 (2025.01); H10D 84/038 (2025.01); H10D 84/83 (2025.01);
Abstract

Structures and formation methods of a semiconductor device structure are provided. The method includes forming a first gate structure over a substrate, and the first gate structure includes a first metal electrode. The method includes forming a second gate structure adjacent to the first gate structure, and the second gate structure includes a second metal electrode. The method also includes forming a mask structure covering the first gate structure and exposing the second gate structure, and etching a portion of the second metal electrode of the second gate structure to form an extending conductive portion. The method includes forming a metal layer over the first gate structure and the extending conductive portion, and etching the metal layer, such that no metal layer is remaining over the first gate structure, and a remaining portion of the metal layer is over the extending conductive portion.


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