The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Aug. 20, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Meng-Han Lin, Hsinchu, TW;

Chia-En Huang, Xinfeng, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 41/27 (2023.01); H01L 25/065 (2023.01); H10B 41/10 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H10B 41/27 (2023.02); H01L 25/0655 (2013.01); H10B 41/10 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02);
Abstract

A semiconductor device comprising a source, and a drain spaced apart from the source in a first direction. A channel layer is disposed radially outwards of at least one radially outer surface of the source and the drain in a second direction perpendicular to the first direction, the channel layer extending in the first direction. A memory layer is disposed on a radially outer surface of the channel layer in the second direction and extending in the first direction. A contact structure is interposed between the channel layer and at least a portion of the source and/or the drain, the contact structure having a lower resistance than the channel layer.


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