The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Jun. 02, 2020
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Keisuke Inoue, Tokyo, JP;
Hiroshi Ono, Tokyo, JP;
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/304 (2013.01); B82Y 40/00 (2013.01);
Abstract
A polishing liquid for CMP, containing: abrasive grains containing silica; and a liquid medium, in which a content of the abrasive grains is 1.0% by mass or more based on the total amount of the polishing liquid, and in a particle size distribution on mass basis obtained by a centrifugation method, D50 of the abrasive grains is 150 nm or less, D90 of the abrasive grains is 100 nm or more, and a difference between the D90 and the D50 is 21 nm or more.
Inoue, Keisuke. (2025). Polishing solution, dispersion, polishing solution production method, and polishing method (U.S. Patent No. 12378438). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12378438
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile