The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Jul. 26, 2019
Applicants:

Dow Silicones Corporation, Midland, MI (US);

Dow Toray Co., Ltd., Toyko, JP;

Inventors:

Lei Fang, Shanghai, CN;

Chen Chen, Shanghai, CN;

Yan Huang, Shanghai, CN;

Masayuki Onishi, Ichihara, JP;

Toyohiko Fujisawa, Ichihara, JP;

Qi Chen, Shanghai, CN;

Guijun Yang, Guangdong, CN;

Assignees:

DOW SILICONES CORPORATION, Midland, MI (US);

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

A curable organopolysiloxane composition is provided. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The curable organopolysiloxane composition can be cured to form a cured product. The cured product generally exhibits an excellent adhesion property against various substrates without cracking and delamination occurring after a thermal shock test.


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