The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Dec. 06, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Nobutaka Fukunaga, Kumamoto, JP;

Masakazu Yarimitsu, Kumamoto, JP;

Katsuhisa Fujii, Kumamoto, JP;

Hidejiro Ryu, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/04 (2006.01); B24B 7/22 (2006.01); B24B 41/06 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 49/04 (2013.01); B24B 7/226 (2013.01); B24B 41/06 (2013.01); B24B 53/017 (2013.01);
Abstract

A substrate processing apparatus includes a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrate is performed; a tilt angle adjusting device configured to adjust a tilt angle of the substrate chuck with respect to the rotary table at the processing position; and a tilt angle controller configured to control the tilt angle adjusting device based on a measurement result of a plate thickness measuring device. The plate thickness measuring device measures a plate thickness of the substrate at the carry-out position.


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