The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Dec. 09, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hirotoshi Mori, Kumamoto, JP;

Hayato Tanoue, Kumamoto, JP;

Yoshihiro Kawaguchi, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01); H01L 21/687 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); H01L 21/268 (2013.01); H01L 21/304 (2013.01); H01L 21/687 (2013.01); B23K 2101/40 (2018.08);
Abstract

A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a front surface of a first substrate and a front surface of a second substrate are bonded to each other, the second substrate; a periphery modification unit configured to form a peripheral modification layer by radiating laser light for periphery to an inside of the first substrate held by the substrate holder along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof; and an internal modification unit configured to form, after the peripheral modification layer is formed by the periphery modification unit, an internal modification layer by radiating laser light for internal surface to the inside of the first substrate held by the substrate holder along a plane direction of the first substrate.


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