The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Mar. 31, 2023
Shinko Electric Industries Co., Ltd., Nagano, JP;
Koichi Nishimura, Nagano, JP;
Kazuhiro Kobayashi, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A wiring substrate includes a wiring layer that includes a first pad on which a first recess portion is formed and a second pad on which a second recess portion is formed; an insulating layer that includes a first opening portion penetrating to the first recess portion and a second opening portion penetrating to the second recess portion; a first metal layer filling each of the first opening portion and the second opening portion, extending on an upper surface of the insulating layer, and including a third recess portion and a fourth recess portion; and a second metal layer a part of which is stored in the third recess portion and the fourth recess portion, wherein the first metal layer has a uniform thickness at a portion extending on the upper surface, and the fourth recess portion is deeper than the third recess portion.