The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Dec. 15, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Joon Hwa Bae, Yongin-si, KR;

Bong Gu Kang, Yongin-si, KR;

Woo Jin Cho, Yongin-si, KR;

Seung Bae Kang, Yongin-si, KR;

Hee Sung Yang, Yongin-si, KR;

Byoung Kwon Choo, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/38 (2023.01); B29C 59/02 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H10K 50/854 (2023.01); H10K 59/122 (2023.01); H10K 59/80 (2023.01); B29L 31/34 (2006.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); B29C 59/02 (2013.01); H01L 25/167 (2013.01); H10K 50/854 (2023.02); H10K 59/38 (2023.02); H10K 59/873 (2023.02); H10K 59/876 (2023.02); H10K 59/877 (2023.02); H10K 59/8792 (2023.02); B29C 2059/027 (2013.01); B29L 2031/3475 (2013.01); H10K 59/122 (2023.02); H10K 2102/331 (2023.02);
Abstract

A method of fabricating a display device includes: preparing a substrate including emission areas and a non-emission area between the emission areas; forming a bank on the non-emission area to a first height; forming light conversion patterns on the emission areas to a height equal to or less than the first height; polishing a surface of a light conversion layer including the bank and the light conversion patterns so that the surface of the light conversion layer is flat; and forming a filler layer on a surface of the substrate on which the light conversion layer is provided. The polishing of the light conversion layer includes planarizing the surface of the light conversion layer so that the bank and the light conversion patterns have a second height through chemical mechanical polishing utilizing a metallic slurry.


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