The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

May. 12, 2022
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yasutaka Nakashiba, Tokyo, JP;

Toshiyuki Hata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/04 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2023.01); H01L 25/075 (2006.01); H10D 30/66 (2025.01);
U.S. Cl.
CPC ...
H01L 24/33 (2013.01); H01L 23/3157 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/73 (2013.01); H01L 25/16 (2013.01); H01L 23/3121 (2013.01); H01L 24/45 (2013.01); H01L 24/46 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/043 (2013.01); H01L 25/074 (2013.01); H01L 25/0756 (2013.01); H01L 2224/0221 (2013.01); H01L 2224/02215 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/0615 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/33505 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/46 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13091 (2013.01); H10D 30/668 (2025.01);
Abstract

A semiconductor device includes: a first semiconductor chip mounted on a chip mounting portion via a first bonding material; and a second semiconductor chip mounted on the first semiconductor chip. Here, the first semiconductor chip has: a protective film located in an uppermost layer; and a first pad electrode exposed from the protective film at an inside of a first opening portion of the protective film. Also, the second semiconductor chip is mounted on a conductive material, which is arranged on the first pad electrode of the first semiconductor chip, via a second bonding material of an insulative property.


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