The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Jan. 06, 2023
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventor:
Ling-Yi Chuang, Hefei, CN;
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/08145 (2013.01);
Abstract
The present disclosure provides a chip structure and a semiconductor structure. The chip structure includes: a substrate; a functional region located on the substrate; a guard ring structure surrounding the functional region; and an auxiliary bonding region located above the guard ring structure, where there is an overlapping region between a projection of at least part of the auxiliary bonding region on the substrate and a projection of the guard ring structure on the substrate.