The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Dec. 21, 2021
International Business Machines Corporation, Armonk, NY (US);
Hsueh-Chung Chen, Cohoes, NY (US);
Su Chen Fan, Cohoes, NY (US);
Dechao Guo, Niskayuna, NY (US);
Carl Radens, LaGrangeville, NY (US);
Indira Seshadri, Niskayuna, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect layer for a device and methods for fabricating the interconnect layer are provided. The interconnect layer includes first metal structures arranged in a first array in the interconnect layer and second metal structures, arranged in a second array in the interconnect layer. The second array includes at least one metal structure positioned between two metal structures of the first metal structures. The interconnect layer also includes a spacer material formed around each of the first metal structures and the second metal structures and air gaps formed in the spacer material on each side of the first metal structures.