The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Jul. 10, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Katherine Chiang, New Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 16/53 (2019.01); G06F 16/532 (2019.01); G06F 17/16 (2006.01); G06V 10/44 (2022.01);
U.S. Cl.
CPC ...
G06V 10/44 (2022.01); G06F 16/532 (2019.01); G06F 17/16 (2013.01);
Abstract
Methods for processing a semiconductor wafer are provided. A plurality of patches are extracted from the query image related to the semiconductor wafer. The patches are encoded with a set of weightings to obtain an encoding matrix. The database is searched based on the encoding matrix to retrieve the images corresponding to the query image. The retrieved images is used to inspect of defects of the semiconductor wafer, so as to generate an inspection result. A semiconductor process is performed on the semiconductor wafer when the inspection result is normal.