The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

May. 05, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

William R. Johanson, Gilroy, CA (US);

Cory Eugene Lafollett, Santa Clara, CA (US);

Kirankumar Neelasandra Savandaiah, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); C23C 14/34 (2013.01); C23C 14/50 (2013.01); H01J 37/32816 (2013.01); H01J 37/32082 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/332 (2013.01);
Abstract

Embodiments of apparatus for high pressure plasma processing are provided herein. In some embodiments, the apparatus includes an isolator plate and grounding bracket for a substrate support, such as an electrostatic chuck, in a plasma processing chamber. In some embodiments, apparatus for high pressure plasma processing includes: an electrostatic chuck; a ground return bracket spaced apart from the electrostatic chuck; and a dielectric plate disposed between the electrostatic chuck and the ground return bracket.


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