The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Apr. 26, 2019
Applicant:

Kao Corporation, Tokyo, JP;

Inventors:

Tomohide Yoshida, Wakayama, JP;

Hirotaka Takeno, Wakayama, JP;

Assignee:

KAO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/322 (2014.01); B22F 1/0545 (2022.01); B22F 1/10 (2022.01); B22F 9/20 (2006.01); B22F 9/24 (2006.01); B82Y 30/00 (2011.01); C08K 5/053 (2006.01); C08L 29/04 (2006.01); C09D 11/30 (2014.01); C09D 11/52 (2014.01); G06K 19/077 (2006.01); H01B 1/20 (2006.01);
U.S. Cl.
CPC ...
C09D 11/322 (2013.01); B22F 1/0545 (2022.01); B22F 1/10 (2022.01); B22F 9/20 (2013.01); B22F 9/24 (2013.01); C08K 5/053 (2013.01); C08L 29/04 (2013.01); C09D 11/30 (2013.01); C09D 11/52 (2013.01); B22F 2302/25 (2013.01); B82Y 30/00 (2013.01); G06K 19/07773 (2013.01); H01B 1/20 (2013.01);
Abstract

The present invention relates to [1] a process for producing a metal fine particle dispersion containing metal fine particles (a) dispersed with a polymer B, including the step 1 of mixing a metal oxide A, the polymer B and a compound C with each other, in which the polymer B contains a hydrophilic group; the compound C is a dihydric alcohol represented by the general formula (1); and the metal fine particles (a) have a cumulant average particle size of not more than 50 nm, and [2] an ink containing the metal line particle dispersion obtained by the production process described in the above [1].


Find Patent Forward Citations

Loading…