The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Jul. 17, 2019
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C25D 11/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C25D 11/38 (2013.01); B32B 2255/06 (2013.01); B32B 2457/08 (2013.01);
Abstract
Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 μg/dm; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.
Shiraokawa, Yoshikatsu. (2025). Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate (U.S. Patent No. 12363826). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12363826
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile