The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Sep. 24, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Kaladhar Radhakrishnan, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/323 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 25/0655 (2013.01); H01F 2027/2809 (2013.01);
Abstract
Embodiments disclosed herein include electronic packages with embedded inductors. In an embodiment, an electronic package comprises a package substrate, where the package substrate comprises a plurality of dielectric layers. In an embodiment, the electronic package further comprises an inductor embedded in the package substrate, where the inductor comprises: a trace with a first end and a second end. In an embodiment, a magnetic material surrounds the trace between the first end and the second end. In an embodiment, a first via is connected to the first end, and a second via is connected to the second end.